Substrate processing apparatus and heater cleaning method

ABSTRACT

A substrate processing apparatus includes a heater having an infrared lamp and a housing for heating an upper surface of a substrate held by a substrate holding mechanism with the heater in opposed relation to the upper surface. A heater cleaning method includes locating the heater at a position above a lower nozzle in opposed relation to a first spout of the lower nozzle, the lower nozzle being in opposed relation to a lower surface of the substrate held by the substrate holding mechanism, and a lower cleaning liquid spouting step of supplying a cleaning liquid to the lower nozzle to spout the cleaning liquid upward from the first spout with no substrate being held by the substrate holding mechanism to thereby supply the cleaning liquid to an outer surface of the housing of the heater located at the heater cleaning position.

TECHNICAL FIELD

The present invention relates to a substrate treatment apparatusincluding a heater having an infrared lamp for heat-treating asubstrate, and a heater cleaning method for cleaning the heater.Examples of the substrate to be heat-treated include semiconductorwafers, glass substrates for liquid crystal display devices, substratesfor plasma display devices, substrates for FED (Field Emission Display)devices, substrates for optical disks, substrates for magnetic disks,substrates for magneto-optical disks, substrates for photo masks,ceramic substrates and substrates for solar cells.

BACKGROUND ART

Semiconductor device production processes include the step of locallyimplanting an impurity (ions) such as phosphorus, arsenic or boron, forexample, into a front surface (major surface) of a semiconductor wafer(hereinafter referred to simply as “wafer”). In order to prevent the ionimplantation into an unnecessary portion of the wafer, a resist patternof a photosensitive resin is formed on the front surface of the wafer tomask the unnecessary portion of the wafer with the resist in this step.After the ion implantation, the resist pattern formed on the frontsurface of the wafer becomes unnecessary. Therefore, a resist removingprocess is performed for removing the unnecessary resist from the frontsurface of the wafer after the ion implantation.

In a typical resist removing process, the front surface of the wafer isirradiated with oxygen plasma to ash the resist on the front surface ofthe wafer. Then, a chemical liquid such as a sulfuric acid/hydrogenperoxide mixture (SPM liquid) which is a liquid mixture of sulfuric acidand a hydrogen peroxide solution is supplied to the front surface of thewafer, whereby the ashed resist is removed. Thus, the removal of theresist from the front surface of the wafer is achieved.

However, the irradiation with the oxygen plasma for the ashing of theresist damages a portion of the front surface of the wafer uncoveredwith the resist (e.g., an oxide film exposed from the resist).

Therefore, a resist removing method such that the SPM liquid is suppliedonto the front surface of the wafer to lift off the resist from thefront surface of the wafer by the strong oxidative power ofperoxosulfuric acid (H₂SO₅) contained in the SPM liquid without ashingthe resist has recently been attracting attention.

CITATION LIST Patent Literature

PTL1: JP2005-93926A

SUMMARY OF INVENTION Technical Problem

The inventor of the present invention contemplates that a chemicalliquid supplied onto a major surface of a substrate is heated to furtherincrease the temperature of the chemical liquid on the major surface ofthe substrate during treatment with the chemical liquid. Morespecifically, the inventor contemplates that a heater having an infraredlamp and a housing accommodating the infrared lamp is located in opposedspaced relation to the major surface of the substrate to heat thechemical liquid present on the major surface of the substrate.

During the heating of the chemical liquid by the infrared lamp, however,the chemical liquid is steeply warmed to generate a great amount ofchemical liquid mist around the major surface of the substrate. Thechemical liquid mist generated during the heating adheres to a lowersurface of the housing of the heater opposed to the major surface of thesubstrate. If the chemical liquid mist remains adhering to the lowersurface of the housing, the intensity of infrared radiation outputtedfrom the housing is reduced due to reduction in the infraredtransmittance of the lower surface of the housing. In addition, thechemical liquid mist is dried to be crystallized, so that the lowersurface of the housing is likely to be come a source of particles.Therefore, it is necessary to wash away the chemical liquid adhering tothe lower surface of the heater housing each time a single substrate istreated.

A conceivable method for cleaning the heater housing is to provide a barnozzle including a plurality of spouts horizontally arranged in a singlerow or in plural rows and each directed vertically downward, and supplya treatment liquid from the respective spouts to the heater from above.However, it is difficult to apply the cleaning liquid over the entirelower surface of the heater housing.

It is an object of the present invention to provide a substratetreatment apparatus and a heater cleaning method which ensure propercleaning of a heater.

Solution to Problem

According to the present invention, there is provided a heater cleaningmethod for cleaning a heater which is arranged in opposed relation to anupper surface (upper major surface) of a substrate held by substrateholding means for heating the upper surface. The heater has an infraredlamp and a housing. The heater cleaning method includes: a heaterlocating step of locating the heater at a heater cleaning position abovea lower nozzle such that the heater is opposed to a first spout of thelower nozzle, the lower nozzle being adapted to spout a liquid upwardfrom the first spout in opposed relation to a lower surface of thesubstrate held by the substrate holding means; and a lower cleaningliquid spouting step of supplying a cleaning liquid to the lower nozzleto spout the cleaning liquid upward from the first spout with nosubstrate being held by the substrate holding means to thereby supplythe cleaning liquid to an outer surface of the housing of the heaterlocated at the heater cleaning position.

In this method, the heater is located at the heater cleaning positionabove the first spout, whereby the heater is opposed to the first spout.In this state, the cleaning liquid is spouted upward from the firstspout. The cleaning liquid from the first spout gushes up to be appliedto a lower portion of the outer surface of the housing of the heaterlocated at the heater cleaning position to clean the lower outer surfaceportion.

The heater is used for heating the substrate held by the substrateholding means for heat treatment. In the heat treatment, the lower outersurface portion of the housing is opposed to the front surface of thesubstrate. After the heat treatment, therefore, foreign matter is likelyto adhere to the lower outer surface portion of the housing. The foreignmatter can be washed away with the cleaning liquid supplied upward,i.e., toward the lower outer surface portion of the housing, from thefirst spout. Thus, the outer surface of the housing can beadvantageously cleaned. Therefore, the outer surface of the housing canbe kept clean.

The housing may have an opposing surface which is opposed to the frontsurface of the substrate when the substrate is heat-treated by theinfrared lamp. The heat treatment may be performed in a state such thata chemical liquid is present on the upper surface of the substrate. Inthis case, the chemical liquid is liable to be steeply warmed togenerate a great amount of chemical liquid mist around the major surfaceof the substrate in the heat treatment. Then, the generated chemicalliquid mist is liable to adhere to the opposing surface of the housing.

Even in this case, however, the opposing surface of the housing of theheater can be cleaned with the cleaning liquid to wash away the chemicalliquid mist adhering to the opposing surface of the housing. Thus, theopposing surface of the housing can be kept clean. This prevents thereduction in the intensity of the infrared radiation outputted from thehousing, and prevents the substrate treatment from being adverselyinfluenced by particles occurring on the housing.

According to one embodiment of the present invention, the method furtherincludes an upper cleaning liquid spouting step of spouting,concurrently with the lower cleaning liquid spouting step, the cleaningliquid downward from an upper nozzle disposed above the first spout(more specifically, above the heater cleaning position) to supply thecleaning liquid to the outer surface of the housing.

In this method, the cleaning liquid is spouted downward from the uppernozzle disposed above the heater located at the heater cleaningposition, while the cleaning liquid is spouted from the lower nozzle.Therefore, the cleaning liquid can extensively spread over the outersurface of the housing. Thus, the outer surface of the housing of theheater can be extensively cleaned.

The upper nozzle may be a ceiling nozzle disposed on a ceiling wall of atreatment chamber in which the substrate holding means is accommodated.

According to another embodiment of the present invention, the methodfurther includes a liquid applying position moving step of moving,concurrently with the lower cleaning liquid spouting step, a liquidapplying position to which the cleaning liquid spouted from the firstspout is applied on the outer surface of the housing.

In this method, the cleaning liquid applying position is moved on theouter surface of the housing, while the cleaning liquid is spouted fromthe first spout. Thus, the cleaning liquid can be extensively applied tothe lower outer surface portion of the housing, thereby permittingeffective cleaning.

The liquid applying position moving step may include the step ofreciprocally moving the heater in a direction (horizontal direction)crossing a cleaning liquid spouting direction in which the cleaningliquid is spouted from the first spout.

According to further another embodiment of the present invention, themethod further includes a drying step of removing the cleaning liquidfrom the outer surface of the housing after completion of the lowercleaning liquid supplying step.

In this method, the cleaning liquid remaining on the outer surface ofthe housing is removed after the heater housing is cleaned with thecleaning liquid. Thus, the substrate treatment is prevented from beingadversely influenced by the cleaning liquid remaining on the outersurface of the housing.

According to still another embodiment of the present invention, thedrying step includes a heat-drying step of irradiating the housing withinfrared radiation emitted from the infrared lamp to heat the outersurface of the housing for drying the outer surface.

In this method, the housing is warmed by the irradiation with theinfrared radiation emitted from the infrared lamp, whereby the cleaningliquid adhering to the outer surface of the housing evaporates to beremoved. Thus, the outer surface of the housing can be advantageouslydried.

According to further another embodiment of the present invention, thelower nozzle further has a second spout through which a gas is spoutedupward, and the drying step includes a lower drying gas spraying step ofsupplying a drying gas to the lower nozzle to spray the drying gasupward from the second spout, whereby the drying gas is supplied to theouter surface of the housing of the heater located at the heatercleaning position.

In this method, the drying gas from the second spout is sprayed onto thelower outer surface portion of the housing of the heater. The cleaningliquid adhering to the lower outer surface portion of the housing isblown away by the drying gas. Thus, the outer surface of the housing canbe advantageously dried.

According to the present invention, there is also provided a substratetreatment apparatus, which includes: a heater having an infrared lampand a housing accommodating the infrared lamp, the heater being adaptedto heat a major surface of a substrate at a treatment position at whichthe heater is opposed to the major surface of the substrate; andcleaning liquid supplying means which supplies a cleaning liquid to anouter surface of the housing with the heater being located at a cleaningposition different from the treatment position.

With this arrangement, the heater is located at the cleaning positiondifferent from the treatment position employed for the heat treatmentand, in this state, the cleaning liquid is supplied to the outer surfaceof the housing of the heater. Thus, foreign matter adhering to the outersurface of the housing can be washed away with the cleaning liquid.Therefore, the outer surface of the housing can be advantageouslycleaned.

The housing may have an opposing surface which is opposed to the frontsurface of the substrate when the heat treatment is performed to heatthe substrate by the infrared lamp. Further, the heat treatment may beperformed on the substrate in a state such that a chemical liquid ispresent on the major surface of the substrate. In this case, thechemical liquid is liable to be steeply warmed by the infrared lamp togenerate a great amount of chemical liquid mist around the major surfaceof the substrate in the heat treatment, and the chemical liquid mist isliable to adhere to the opposing surface of the housing.

However, the chemical liquid mist is washed away by supplying thecleaning liquid to the heater. Thus, the opposing surface of the housingcan be cleaned. This prevents the reduction in the intensity of theinfrared radiation outputted from the housing, and prevents thesubstrate treatment from being adversely influenced by particlesoccurring on the housing.

The cleaning position may be a stand-by position at which the heater isin stand-by and is retracted from the treatment position. With thisarrangement, the cleaning operation is performed on the heater locatedat the stand-by position. Since the heater is located at the stand-byposition, the heater can be cleaned irrespective of the progressionstatus of the substrate treatment. That is, the heater can be cleanedwithout interrupting the substrate treatment, thereby increasing theproductivity in the substrate treatment apparatus.

According to still another embodiment of the present invention, thesubstrate treatment apparatus further includes an accommodating memberwhich accommodates the heater and receives cleaning liquid splashed fromthe heater. With this arrangement, the cleaning liquid is substantiallyprevented from scattering around the heater.

In this case, the accommodating member may include a bottomed storagecontainer which has a drain port provided in its bottom and is capableof storing a liquid, and the cleaning liquid supplying means may includea cleaning liquid nozzle which supplies the cleaning liquid to thestorage container. In this case, the substrate treatment apparatus mayfurther include a drainage line which is connected to the drain port ofthe storage container for draining the liquid stored in the storagecontainer, and a drain valve provided in the drainage line for openingand closing the drainage line.

With this arrangement, the draining of the cleaning liquid from thebottomed container is prevented by closing the drain valve. In thisstate, the cleaning liquid is supplied from the cleaning liquid nozzleto be stored in the storage container. The outer surface of the housingof the heater is immersed in the cleaning liquid stored in the storagecontainer to be thereby cleaned.

The cleaning liquid supplying means may include a cleaning liquid nozzlehaving a cleaning liquid spout through which the cleaning liquid isspouted toward the outer surface of the housing.

According to further another embodiment of the present invention, thesubstrate treatment apparatus further includes drying gas spraying meanswhich sprays a drying gas toward the outer surface of the housing forremoving the cleaning liquid from the outer surface of the housing.

With this arrangement, the drying gas is sprayed from the drying gasspraying means to the housing of the heater. The cleaning liquidadhering to the outer surface of the housing is blown away by the dryinggas. Thus, the outer surface of the housing can be advantageously dried.

According to still another embodiment of the present invention, thesubstrate treatment apparatus further includes heater up-and-down movingmeans which moves up and down the heater. The drying gas spraying meansincludes a drying gas nozzle which spouts the drying gas in a directioncrossing a heater up-and-down moving direction. The substrate treatmentapparatus further includes spray-drying controlling means which controlsthe drying gas spraying means and the heater up-and-down moving means tospout the drying gas from the drying gas nozzle and move up and down theheater to thereby move up and down a drying gas supply position to whichthe drying gas is supplied on the outer surface of the housing.

With this arrangement, the drying gas is spouted sideward from thedrying gas nozzle, while the heater is moved up and down in opposedrelation to a spout of the drying gas nozzle. Therefore, the drying gasis sprayed to a wider region of the outer surface (preferably, theentire outer surface) of the housing, so that the cleaning liquid can beremoved from the wider region of the outer surface (preferably, theentire outer surface) of the housing. Thus, the outer surface of thehousing can be advantageously dried.

According to further another embodiment of the present invention, thesubstrate treatment apparatus further includes heat-drying controllingmeans which irradiates the housing with infrared radiation emitted fromthe infrared lamp to heat the cleaning liquid adhering to the outersurface for drying the outer surface. With this arrangement, the housingis heated by the irradiation with the infrared radiation emitted fromthe infrared lamp, whereby the cleaning liquid adhering to the outersurface of the housing is removed. Thus, the outer surface of thehousing can be advantageously dried.

According to the present invention, there is also provided a heatercleaning method for cleaning a heater which heats a major surface of asubstrate at a treatment position at which the heater is opposed to themajor surface of the substrate. The heater has an infrared lamp and ahousing accommodating the infrared lamp. The heater cleaning methodincludes a heater locating step of locating the heater at a cleaningposition different from the treatment position, and a cleaning liquidsupplying step of supplying a cleaning liquid to an outer surface of theheater located at the cleaning position.

According to still another embodiment of the present invention, themethod further includes a drying step of removing the cleaning liquidfrom the outer surface of the housing after completion of the cleaningliquid supplying step.

In this method, the cleaning liquid remaining on the outer surface ofthe housing is removed after the heater is cleaned by supplying thecleaning liquid. Thus, the substrate treatment is prevented from beingadversely influenced by the cleaning liquid remaining on the outersurface of the housing.

According to further another embodiment of the present invention, thedrying step includes a heat-drying step of irradiating the housing withinfrared radiation emitted from the infrared lamp to heat the cleaningliquid on the outer surface for drying the outer surface.

According to still another embodiment of the present invention, thedrying step includes a heater up-and-down moving step of moving up anddown the heater, and a drying gas spouting step of spouting a drying gasfrom a drying gas nozzle toward the outer surface of the housing in adirection crossing a heater up-and-down moving direction.

The foregoing and other objects, features and effects of the presentinvention will become more apparent from the following description ofembodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram schematically showing the construction of asubstrate treatment apparatus which performs a heater cleaning methodaccording to one embodiment of the present invention.

FIG. 2 is a schematic sectional view of a heater head provided in thesubstrate treatment apparatus.

FIG. 3 is a perspective view of an infrared lamp provided in the heaterhead.

FIG. 4 is a block diagram showing the electrical construction of thesubstrate treatment apparatus shown in FIG. 1.

FIG. 5 is a process diagram showing an exemplary resist removing processto be performed by the substrate treatment apparatus.

FIG. 6A is a schematic diagram for explaining an SPM liquid film formingstep.

FIG. 6B is a schematic diagram for explaining an SPM liquid film heatingstep.

FIG. 7 is a plan view showing a heater head moving range in the SPMliquid film heating step.

FIG. 8 is a flow chart showing an exemplary heater head cleaning/dryingstep.

FIG. 9A is a schematic diagram for explaining a step of the heater headcleaning/drying step.

FIG. 9B is a schematic diagram showing a step subsequent to the step ofFIG. 9A.

FIG. 10 is a plan view showing a heater head moving range in the heaterhead cleaning/drying step.

FIG. 11 is a diagram schematically showing the construction of asubstrate treatment apparatus according to another embodiment of thepresent invention.

FIG. 12 is a diagram showing the structure of a cleaning pod provided inthe substrate treatment apparatus shown in FIG. 11.

FIG. 13 is a block diagram showing the electrical construction of thesubstrate treatment apparatus shown in FIG. 11.

FIG. 14 is a flow chart showing a process sequence of a heater headcleaning/drying step to be performed in the substrate treatmentapparatus of FIG. 11.

FIG. 15A is a schematic diagram for explaining a step of the heater headcleaning/drying step.

FIG. 15B is a schematic diagram showing a step subsequent to the step ofFIG. 15A.

FIG. 15C is a schematic diagram showing a step subsequent to the step ofFIG. 15B.

FIG. 16 is a diagram showing the structure of another exemplary cleaningpod.

FIG. 17 is a sectional view taken along a sectional line A-A and viewedin an arrow direction in FIG. 16.

FIG. 18 is a diagram showing the structure of further another exemplarycleaning pod.

FIG. 19 is a sectional view taken along a sectional line B-B and viewedin an arrow direction in FIG. 18.

DESCRIPTION OF EMBODIMENTS

FIG. 1 is a diagram schematically showing the construction of asubstrate treatment apparatus 1 which performs a heater cleaning methodaccording to one embodiment of the present invention. The substratetreatment apparatus 1 is an apparatus of a single substrate treatmenttype which is used for removing an unnecessary resist from a frontsurface (major surface) of a wafer W (exemplary substrate) after thefront surface of the wafer W is subjected to an ion implantation processfor an impurity implantation or subjected to a dry etching process.

The substrate treatment apparatus 1 includes a treatment chamber 2defined by a partition wall 2A. A fan/filter unit (not shown) forsupplying clean air into the treatment chamber 2 is provided in aceiling wall of the treatment chamber 2. The clean air is air preparedby cleaning air in a clean room in which the substrate treatmentapparatus 1 is provided.

The substrate treatment apparatus 1 includes a wafer rotating mechanism(substrate holding means) 3, a removal liquid nozzle (chemical liquidsupplying means) 4 and a heater head (heater) 35 provided in thetreatment chamber 2. The wafer rotating mechanism 3 holds and rotates awafer W. The removal liquid nozzle 4 supplies an SPM liquid (chemicalliquid) as an exemplary resist removal liquid to a front surface (uppersurface) of the wafer W held by the wafer rotating mechanism 3. Theheater head 35 is located in opposed relation to the front surface ofthe wafer W held by the wafer rotating mechanism 3 to heat the SPMliquid on the front surface of the wafer W.

The wafer rotating mechanism 3 may be, for example, of a clamping type.More specifically, the wafer rotating mechanism 3 includes, for example,a generally vertically extending spin shaft 7, a disk-shaped spin base 8generally horizontally attached to an upper end of the spin shaft 7, anda plurality of clamping members 9 provided at positions generallyequidistantly circumferentially of the spin base 8. The clamping members9 clamp the wafer W in abutment against a peripheral surface of thewafer W, whereby the wafer W is generally horizontally held with itscenter located on a center axis of the spin shaft V.

A rotative force is inputted to the spin shaft 7 from a chuck rotativedrive mechanism 6 including a motor (not shown). The rotative force thusinputted rotates the spin shaft 7, whereby the wafer W clamped by theclamping members 9 is generally horizontally held and rotated about apredetermined rotation axis (vertical axis) C together with the spinbase 8. The chuck rotative drive mechanism 6 may be in the form of ahollow motor which includes a rotor (drive shaft) integral with the spinshaft 7 and a stator disposed around the rotor with the spin shaft 7extending vertically therethrough (see FIG. 11).

The spin shaft 7 is a hollow shaft, and a back side liquid supply pipe80 and a back side gas supply pipe 81 extending vertically are insertedin the spin shaft 7. An upper end of the back side liquid supply pipe 80and an upper end of the back side gas supply pipe 81 are connected to aback side nozzle (lower nozzle) 82 provided at the upper end of the spinshaft 7. The back side nozzle 82 has a round backside liquid spout(first spout) 84 and a round back side gas spout (second spout) 85provided at its upper end. The back side liquid spout 84 and the backside gas spout 85 are disposed in closely adjacent relation. The spouts84, 85 are generally opposed to the rotation center of a lower surfaceof the wafer W held by the wafer rotating mechanism 3. The back sideliquid spout 84 and the back side gas spout 85 are disposed at the sameheight level.

A lower cleaning liquid supply line 86 to which DIW (deionized water) issupplied as an exemplary cleaning liquid is connected to the back sideliquid supply pipe 80. A lower cleaning liquid valve 87 for opening andclosing the lower cleaning liquid supply line 86 is provided in thelower cleaning liquid supply line 86.

A lower drying gas supply line 88 to which nitrogen gas is supplied asan exemplary drying gas is connected to the back side gas supply pipe81. A lower drying gas valve 89 for opening and closing the lower dryinggas supply line 88 is provided in the lower drying gas supply line 88.

The removal liquid nozzle 4 is, for example, a straight nozzle whichspouts the SPM liquid in the form of a continuous stream. The removalliquid nozzle 4 is attached to a distal end of a generally horizontallyextending first liquid arm 11 with its spout directed downward. Thefirst liquid arm 11 is pivotal about a predetermined vertical pivotaxis. A first liquid arm pivot mechanism 12 for pivoting the firstliquid arm 11 within a predetermined angular range is connected to thefirst liquid arm 11. By pivoting the first liquid arm 11, the removalliquid nozzle 4 is moved between a position on the rotation axis C ofthe wafer W (at which the removal liquid nozzle is opposed to therotation center of the wafer W) and a home position defined on a lateralside of the wafer rotating mechanism 3. The home position is a stand-byposition at which the heater head 35 is in stand-by after beingretracted from above the wafer W.

A removal liquid supply line 15 to which the SPM liquid is supplied froman SPM supply source is connected to the removal liquid nozzle 4. Aremoval liquid valve 23 for switching on and off the supply of the SPMliquid from the removal liquid nozzle 4 is provided in the removalliquid supply line 15.

The substrate treatment apparatus 1 further includes a DIW nozzle 24, anSC1 nozzle 25 and a cup 5. The DIW nozzle 24 supplies DIW (deionizedwater) as a rinse liquid to the front surface of the wafer W held by thewafer rotating mechanism 3. The SC1 nozzle 25 supplies SC1 (anammonia-hydrogen peroxide mixture) as a cleaning chemical liquid to thefront surface of the wafer W held by the wafer rotating mechanism 3. Thecup 5 surrounds the wafer rotating mechanism 3 to receive SPM liquid,SC1 and DIW flowing down or splashed from the wafer W.

The DIW nozzle 24 is, for example, a straight nozzle which spouts theDIW in the form of a continuous stream, and is fixedly disposed abovethe wafer rotating mechanism 3 with its spout directed toward around therotation center of the wafer W. A DIW supply line 26 to which the DIW issupplied from a DIW supply source is connected to the DIW nozzle 24. ADIW valve 27 for switching on and off the supply of the DIW from the DIWnozzle 24 is provided in the DIW supply line 26.

The SC1 nozzle 25 is, for example, a straight nozzle which spouts theSC1 in the form of a continuous stream. The SC1 nozzle 25 is attached toa distal end of a generally horizontally extending second liquid arm 28with its spout directed downward. The second liquid arm 28 is pivotalabout a predetermined vertical pivot axis. A second liquid arm pivotmechanism 29 for pivoting the second liquid arm 28 within apredetermined angular range is connected to the second liquid arm 28. Bypivoting the second liquid arm 28, the SC1 nozzle 25 is moved between aposition on the rotation axis C of the wafer W (at which the SC1 nozzleis opposed to the rotation center of the wafer W) and a home positiondefined on a lateral side of the wafer rotating mechanism 3.

An SC1 supply line 30 to which the SC1 is supplied from an SC1 supplysource is connected to the SC1 nozzle 25. An SC1 valve 31 for switchingon and off the supply of the SC1 from the SC1 nozzle 25 is provided inthe SC1 supply line 30.

A vertically extending support shaft 33 is disposed on a lateral side ofthe wafer rotating mechanism 3. A horizontally extending heater arm 34is connected to an upper end of the support shaft 33. The heater head35, in which an infrared lamp 38 is accommodated, is attached to adistal end of the heater arm 34. A pivot drive mechanism 36 whichrotates the support shaft 33 about its center axis and a lift drivemechanism 37 which moves up and down the support shaft 33 along itscenter axis are connected to the support shaft 33.

A driving force is inputted to the support shaft 33 from the pivot drivemechanism 36 to rotate the support shaft 33 within a predeterminedangular range, whereby the heater arm 34 is pivoted about the supportshaft 33 above the wafer W held by the wafer rotating mechanism 3. Bypivoting the heater arm 34, the heater head 35 is moved between aposition on the rotation axis C of the wafer W (at which the heater headis opposed to the rotation center of the wafer W) and a home positiondefined on a lateral side of the wafer rotating mechanism 3. Further, adriving force is inputted to the support shaft 33 from the lift drivemechanism 37 to move up and down the support shaft 33, whereby theheater head 35 is moved up and down between a position adjacent to thefront surface of the wafer W held by the wafer rotating mechanism 3 (aheight position indicated by a two-dot-and-dash line in FIG. 1, andincluding a center adjacent position and an edge adjacent position to bedescribed later) and a retracted position above the wafer W (a heightposition indicated by a solid line in FIG. 1). In this embodiment, theadjacent position is defined such that a distance between a lowersurface (opposing surface) 52B of the heater head 35 and the frontsurface of the wafer W held by the wafer rotating mechanism 3 is, forexample, 3 mm.

An upper cleaning liquid nozzle (ceiling nozzle) 94 and an upper dryinggas nozzle (ceiling nozzle) 95 are provided in closely juxtaposedrelation above the rotation axis C of the wafer rotating mechanism 3 ona lower surface of the ceiling wall of the treatment chamber 2.

The upper cleaning liquid nozzle 94 has a spout through which a liquidis spouted downward in a shower form. An upper cleaning liquid supplyline 90 to which a cleaning liquid is supplied is connected to the uppercleaning liquid nozzle 94. An upper cleaning liquid valve 91 for openingand closing the upper cleaning liquid supply line 90 is provided in theupper cleaning liquid supply line 90.

The upper drying gas nozzle 95 has a spout through which a gas isspouted vertically downward. An upper drying gas supply line 92 to whichnitrogen gas is supplied as an exemplary drying gas is connected to theupper drying gas nozzle 95. An upper drying gas valve 93 for opening andclosing the upper drying gas supply line 92 is provided in the upperdrying gas supply line 92.

FIG. 2 is a schematic sectional view showing the structure of the heaterhead 35.

The heater head 35 includes the infrared lamp 38, a lamp housing(housing) 40 which is a bottomed container having a top opening 39 andaccommodating the infrared lamp 38, a support member 42 which supportsthe infrared lamp 38 while suspending the infrared lamp 38 in the lamphousing 40, and a lid (housing) 41 which closes the opening 39 of thelamp housing 40. In this embodiment, the lid 41 is fixed to the distalend of the heater arm 34.

FIG. 3 is a perspective view showing an exemplary structure of theinfrared lamp 38. As shown in FIGS. 2 and 3, the infrared lamp 38 is aunitary infrared lamp heater which includes an annular portion 43 havingan annular (arcuate) shape, and a pair of straight portions 44, 45extending vertically upward from opposite ends of the annular portion 43along a center axis of the annular portion 43. The annular portion 43mainly functions as a light emitting portion which emits infraredradiation. In this embodiment, the annular portion 43 has a diameter(outer diameter) of, for example, about 60 mm. With the infrared lamp 38supported by the support member 42, the annular portion 43 assumes ahorizontal attitude. In other words, the center axis of the annularportion 43 is an axis (vertical axis) perpendicular to the front surfaceof the wafer W held by the wafer rotating mechanism 3.

The infrared lamp 38 is configured such that a filament is accommodatedin a quartz tube. An amplifier (see FIG. 4) for voltage supply isconnected to the infrared lamp 38. Usable as the infrared lamp 38 areinfrared heaters of shorter wavelength, intermediate wavelength andlonger wavelength typified by halogen lamps and carbon lamps.

As shown in FIG. 2, the lid 41 has a disk shape, and is fixed to theheater arm 34 in a horizontal attitude. The lid 41 is formed of afluororesin such as PTFE (polytetrafluoroethylene). In this embodiment,the lid 41 is formed integrally with the heater arm 34. However, the lid41 may be formed separately from the heater arm 34. Exemplary materialsfor the lid 41 other than the resin material such as PTFE includeceramic materials and quartz.

The lid 41 has a generally cylindrical groove 51 formed in a lowersurface 49 thereof. The groove 51 has a horizontal flat upper basesurface 50, and an upper surface 42A of the support member 42 is fixedto the upper base surface 50 in contact with the upper base surface 50.The lid 41 has insertion holes 58, 59 extending in a vertical direction(vertically) through the upper base surface 50. Upper end portions ofthe straight portions 44, 45 of the infrared lamp 38 are respectivelyinserted in the insertion holes 58, 59.

The lamp housing 40 is a bottomed cylindrical container. The lamphousing 40 is formed of quartz.

The lamp housing 40 is fixed to the lower surface 49 of the lid 41 (inthis embodiment, a portion of the lower surface not formed with thegroove 51) with its opening 39 facing up. An annular flange 40A projectsradially outward (horizontally) from a peripheral edge of the opening ofthe lamp housing 40. The flange 40A is fixed to the lower surface 49 ofthe lid 41 with a fixture unit such as bolts (not shown), whereby thelamp housing 40 is supported by the lid 41.

In this state, a bottom plate 52 of the lamp housing 40 has a horizontaldisk shape. The bottom plate 52 has an upper surface 52A and a lowersurface 52B (opposing surface) which are horizontal flat surfaces. Inthe lamp housing 40, a lower portion of the annular portion 43 of theinfrared lamp 38 is located in closely opposed relation to the uppersurface 52A of the bottom plate 52. The annular portion 43 and thebottom plate 52 are parallel to each other. In other words, the lowerportion of the annular portion 43 is covered with the bottom plate 52 ofthe lamp housing 40. In this embodiment, the lamp housing 40 has anouter diameter of, for example, about 85 mm. Further, a verticaldistance between the infrared lamp 38 (a lower portion of the annularportion 43) and the upper surface 52A is set to, for example, about 2mm.

The support member 42 is a thick plate (having a generally disk shape),and is attached and fixed to the lid 41 from below in a horizontalattitude by bolts 56 or the like. The support member 42 is formed of aheat-resistant material (e.g., a ceramic or quartz). The support member42 has two insertion holes 46, 47 extending in a vertical direction(vertically) through its upper surface 42A and lower surface 42B. Thestraight portions 44, 45 of the infrared lamp 38 are respectivelyinserted in the insertion holes 46, 47.

O-rings are respectively fixedly fitted around intermediate portions ofthe straight portions 44, 45. With the straight portions 44, 45respectively inserted in the insertion holes 46, 47, outer peripheriesof the O-rings 48 are kept in press contact with inner walls of thecorresponding insertion holes 46, 47. Thus, the straight portions 44, 45are prevented from being withdrawn from the respective insertion holes46, 47, whereby the infrared lamp 38 is suspended to be supported by thesupport member 42.

When power is supplied to the infrared lamp 38 from the amplifier 54,the infrared lamp 38 emits infrared radiation. The infrared radiation isoutputted through the lamp housing 40 downward of the heater head 35.The infrared radiation outputted through the bottom plate 52 of the lamphousing 40 heats the SPM liquid on the wafer W.

In a resist removing process to be described later, more specifically,the bottom plate 52 of the lamp housing 40 which defines the lowersurface of the heater head 35 is located in opposed relation to thefront surface of the wafer W held by the wafer rotating mechanism 3. Inthis state, the infrared radiation outputted through the bottom plate 52of the lamp housing 40 heats the wafer W and the SPM liquid present onthe wafer W.

The lid 41 is formed with a gas supply passage 60 through which air issupplied into the lamp housing 40, and an evacuation passage 61 throughwhich an internal atmosphere of the lamp housing 40 is expelled. The gassupply passage 60 and the evacuation passage 61 respectively have a gassupply port 62 and an evacuation port 63 which are open in the lowersurface of the lid 41. The gas supply passage 60 is connected to one endof a gas supply line 64. The other end of the gas supply line 64 isconnected to an air supply source. The evacuation passage 61 isconnected to one end of an evacuation line 65. The other end of theevacuation line 65 is connected to an evacuation source.

FIG. 4 is a block diagram showing the electrical construction of thesubstrate treatment apparatus 1. The substrate treatment apparatus 1includes a controller 55 including a micro computer. The controller 55is connected to the chuck rotative drive mechanism 6, the amplifier 54,the pivot drive mechanism 36, the lift drive mechanism 37, the firstliquid arm pivot mechanism 12, the second liquid arm pivot mechanism 29,the removal liquid valve 23, the DIW valve 27, the SC1 valve 31, thelower cleaning liquid valve 87, the lower drying gas valve 89, the uppercleaning liquid valve 91, the upper drying gas valve 93 and the like,which are controlled by the controller 55.

FIG. 5 is a process diagram showing an exemplary resist removing processto be performed by the substrate treatment apparatus 1. FIG. 6A is aschematic diagram for explaining an SPM liquid film forming step to bedescribed later. FIG. 6B is a schematic diagram for explaining an SPMliquid film heating step to be described later. FIG. 7 is a plan viewshowing a movement range of the heater head 35 in the SPM liquid filmheating step to be described later.

Referring to FIGS. 1 to 7, the exemplary resist removing process willhereinafter be described.

In the resist removing process, a wafer W having been subjected to anion implantation process is loaded into the treatment chamber 2 (seeFIG. 1) by a transport robot (not shown) controlled by the controller 55(Step S1: Wafer loading step). The wafer W is transferred to the waferrotating mechanism 3 with its front surface facing up. At this time, theheater head 35, the removal liquid nozzle 4 and the SC1 nozzle 25 arelocated at their home positions so as not to prevent the loading of thewafer W.

With the wafer W held by the wafer rotating mechanism 3, the controller55 controls the chuck rotative drive mechanism 6 to start rotating thewafer W (Step S2). The rotation speed of the wafer W is increased to aliquid puddling speed (in a range of 30 to 300 rpm, e.g., 60 rpm), andthen maintained at the liquid puddling speed. The liquid puddling speedis such that the wafer W can be covered with the SPM liquid to bethereafter supplied thereto, i.e., a liquid film of the SPM liquid canbe retained on the front surface of the wafer W. Further, the controller55 controls the first liquid arm pivot mechanism 12 to move the removalliquid nozzle 4 to above the wafer W.

After the rotation speed of the wafer W reaches the liquid puddlingspeed, the controller 55 opens the removal liquid valve 23 to supply theSPM liquid to the front surface of the wafer W from the removal liquidnozzle 4 as shown in FIG. 6A. The SPM liquid supplied to the frontsurface of the wafer W is retained on the front surface of the wafer W,whereby an SPM liquid film 70 is formed on the front surface of thewafer W as covering the entire surface (Step S3: SPM liquid film formingstep).

At the start of the SPM liquid film forming step, as shown in FIG. 6A,the controller 55 controls the first liquid arm pivot mechanism 12 tolocate the removal liquid nozzle 4 above the rotation center of thewafer W, and spouts the SPM liquid from the removal liquid nozzle 4. Inthis manner, the SPM liquid film 70 is formed on the front surface ofthe wafer W, whereby the SPM liquid spreads over the entire frontsurface of the wafer W. Thus, the entire front surface of the wafer Wcan be covered with the SPM liquid film 70.

After a lapse of a predetermined liquid film forming period from thestart of the spouting of the SPM liquid from the removal liquid nozzle4, the controller 55 controls the chuck rotative drive mechanism 6 toreduce the rotation speed of the wafer W to a predetermined heattreatment speed that is lower than the liquid puddling speed. Then, theSPM liquid film heating step (heat treatment) of Step S4 is performed.

The heat treatment speed is such that the SPM liquid film 70 can beretained on the front surface of the wafer W without the supply of theSPM liquid to the wafer W (in a range of 1 to 20 rpm, e.g., 15 rpm). Insynchronism with the deceleration of the wafer W by the chuck rotativedrive mechanism 6, as shown in FIG. 6B, the controller 55 closes theremoval liquid valve 23 to stop supplying the SPM liquid from theremoval liquid nozzle 4, and controls the first liquid arm pivotmechanism 12 to move the removal liquid nozzle 4 back to its homeposition. Although the supply of the SPM liquid to the wafer W isstopped, the SPM liquid film 70 is continuously retained on the frontsurface of the wafer W by reducing the rotation speed of the wafer W tothe heat treatment speed.

As shown in FIGS. 6B and 7, the controller 55 controls the amplifier 54to emit the infrared radiation from the infrared lamp 38. Further, thecontroller 55 controls the pivot drive mechanism 36 and the lift drivemechanism 37 to move the heater head 35 from its home position andfurther reciprocally move the heater head 35 between the center adjacentposition (indicated by solid lines in FIGS. 6B and 7) at which theheater head is opposed to the rotation center of the wafer W and theedge adjacent position (indicated by two-dot-and-dash lines in FIGS. 6Band 7) at which the heater head is opposed to the peripheral edge of thewafer W. Portions of the wafer Wand the SPM liquid present under theinfrared lamp 38 are steeply warmed by the infrared radiation emittedfrom the infrared lamp 38, whereby the SPM liquid is warmed around aninterface between the wafer W and the SPM liquid. Then, a portion of thefront surface of the wafer W opposed to the lower surface 52B of thebottom plate 52 (opposed to the infrared lamp 38) is reciprocally movedalong an arcuate path within a range extending from a region includingthe rotation center of the wafer W to a region including the peripheraledge of the wafer W. Thus, the entire front surface of the wafer W canbe heated.

The portion of the SPM liquid under the infrared lamp 38 is steeplywarmed by the infrared radiation emitted from the infrared lamp 38.Therefore, a great amount of mist of the SPM liquid is generated aroundthe front surface of the wafer W.

The edge adjacent position is such that the lower surface 52B of thebottom plate 52, more preferably, the annular portion 43 of the infraredlamp 38, projects radially outward from the outer periphery of the waferW when the heater head 35 is seen from above.

In the SPM liquid film heating step of Step S4, the SPM liquid film 70is warmed around the interface between the front surface of the wafer Wand the SPM liquid. During this period, a reaction between the SPMliquid and the resist on the front surface of the wafer W proceeds,whereby the resist is removed from the front surface of the wafer W.

After a lapse of a predetermined liquid film heating period from thereduction of the rotation speed of the wafer W, the controller 55controls the amplifier 54 to stop emitting the infrared radiation fromthe infrared lamp 38. Further, the controller 55 controls the pivotdrive mechanism 36 and the lift drive mechanism 37 to move the heaterhead 35 back to its home position. After completion of the SPM liquidfilm heating step, a great amount of the SPM liquid mist adheres to thelower surface 52B of the lamp housing 40 of the heater head 35.

The controller 55 controls the chuck rotative drive mechanism 6 toincrease the rotation speed of the wafer W to a predetermined liquidtreatment rotation speed (in a range of 300 to 1500 rpm, e.g., 1000rpm). Further, the controller 55 opens the DIW valve 27 to supply theDIW from the spout of the DIW nozzle 24 toward around the rotationcenter of the wafer W (Step S5: Intermediate rinsing step). The DIWsupplied to the front surface of the wafer W receives a centrifugalforce generated by the rotation of the wafer W to flow toward theperipheral edge of the wafer W on the front surface of the wafer W.Thus, SPM liquid adhering to the front surface of the wafer W is rinsedaway with the DIW.

After a lapse of a predetermined intermediate rinsing period from thestart of the supply of the DIW, the DIW valve 27 is closed to stopsupplying the DIW to the front surface of the wafer W.

While maintaining the rotation speed of the wafer W at the liquidtreatment rotation speed, the controller 55 opens the SC1 valve 31 tosupply the SC1 from the SC1 nozzle 25 to the front surface of the waferW (Step S6). The controller 55 controls the second liquid arm pivotmechanism 29 to pivot the second liquid arm 28 within the predeterminedangular range to reciprocally move the SC1 nozzle 25 between a positionabove the rotation center of the wafer W and a position above theperipheral edge of the wafer W. Thus, an SC1 supply position to whichthe SC1 is supplied from the SC1 nozzle 25 on the front surface of thewafer W is reciprocally moved along an arcuate path crossing the waferrotating direction in a range from the rotation center of the wafer W tothe peripheral edge of the wafer W. Thus, the SC1 uniformly spreads overthe entire front surface of the wafer W, whereby foreign matter such asresist residue and particles adhering to the front surface of the waferW can be removed by the chemical power of the SC1.

After the supply of the SC1 is continued for a predetermined SC1 supplyperiod, the controller 55 closes the SC1 valve 31, and controls thesecond liquid arm pivot mechanism 29 to move the SC1 nozzle 25 back toits home position. While maintaining the rotation speed of the wafer Wat the liquid treatment rotation speed, the controller 55 opens the DIWvalve 27 to supply the DIW from the spout of the DIW nozzle 24 towardaround the rotation center of the wafer W (Step S7: Rinsing step). TheDIW supplied to the front surface of the wafer W receives a centrifugalforce generated by the rotation of the wafer W to flow toward theperipheral edge of the wafer W on the front surface of the wafer W,whereby SC1 adhering to the front surface of the wafer W is rinsed awaywith the DIW.

After the supply of the DIW is continued for a predetermined rinsingperiod, the DIW valve 27 is closed to stop supplying the DIW to thefront surface of the wafer W.

After a lapse of a predetermined period from the start of the rinsingstep, the controller 55 closes the DIW valve 27 to stop supplying theDIW to the front surface of the wafer W. Thereafter, the controller 55controls the chuck rotative drive mechanism 6 to increase the rotationspeed of the wafer W to a predetermined higher rotation speed (e.g.,1500 to 2500 rpm), whereby a spin drying operation is performed to spinoff the DIW from the wafer W to dry the wafer W (Step S8).

After the spin drying operation is performed for a predetermined spindrying period, the controller 55 controls the chuck rotative drivemechanism 6 to stop rotating the wafer rotating mechanism 3. Thus, theresist removing process is completed for the single wafer W, and thetreated wafer W is unloaded from the treatment chamber 2 by thetransport robot (Step S9).

After the unloading of the wafer W, a heater head cleaning/drying stepis performed to clean and then dry the heater head 35 (Step S10). In theheater head cleaning/drying step, a cleaning operation is performed toclean the heater head 35, and a drying operation is performed on thecleaned heater head 35. Upon completion of the heater headcleaning/drying step of Step S10, the process sequence for the resistremoving process is completed for the single wafer W.

FIG. 8 is a flow chart for explaining an example of the heater headcleaning/drying step. FIG. 9A is a schematic diagram for explaining thecleaning operation of the heater head cleaning/drying step. FIG. 9B is aschematic diagram for explaining the drying operation of the heater headcleaning/drying step. FIG. 10 is a plan view showing a moving range ofthe heater head 35 in the heater head cleaning/drying step.

In the cleaning operation of the heater head cleaning/drying step, thecontroller 55 controls the pivot drive mechanism 36 to pivot the heaterarm 34, and controls the lift drive mechanism 37 to move up or down theheater head 35 from its home position to a heater cleaning positiondefined above the wafer rotating mechanism 3. At this time, no wafer Wis held by the wafer rotating mechanism 3. Therefore, the heater head 35is located in opposed relation to the upper surface of the spin base 8(Step S21: Heater locating step). More specifically, the round lowersurface 52B of the heater head 35 (lamp housing 40) is located at theheater cleaning position above the rotation center (on the rotation axisC) of the wafer rotating mechanism 3. The heater cleaning position isdesirably a height position such that the cleaning liquid gushing upfrom the back side liquid spout 84 reaches the lower surface 52B of theheater head 35.

As shown in FIG. 9A, the controller 55 opens the upper cleaning liquidvalve 91 (see FIG. 1 and the like) to spout the cleaning liquid downwardfrom the upper cleaning liquid nozzle 94 in a shower form (Step S22:Upper cleaning liquid spouting step). Thus, the cleaning liquid flowingdown from the upper cleaning liquid nozzle 94 falls over the heater head35 located at the heater cleaning position. That is, the cleaning liquidis applied to an upper surface of the heater head (e.g., an uppersurface of the lid 41).

Further, the controller 55 opens the lower cleaning liquid valve 87 (seeFIG. 1 and the like) to spout the cleaning liquid vertically upward fromthe back side liquid spout 84 of the back side nozzle 82 (Step S22:Lower cleaning liquid spouting step). Thus, the cleaning liquid gushesvertically upward from the backside liquid spout 84. The cleaning liquidgushing up from the back side liquid spout 84 is applied to the lowersurface 52B of the bottom plate 52 of the lamp housing 40 which definesthe lower surface of the heater head 35.

Further, the controller 55 controls the pivot drive mechanism 36 topivot the heater arm 34 to reciprocally move the heater head 35 betweena first movement end position and a second movement end position. Anyposition in a range between the first movement end position and thesecond movement end position is the heater cleaning position. The firstmovement end position is defined between the center of the spin base 8and one of opposite peripheral positions of the spin base 8 above thespin base 8 as indicated by a solid line in FIG. 10. The second movementend position is defined between the center of the spin base 8 and theother peripheral position of the spin base 8 above the spin base 8 asindicated by a two-dot- and dash line in FIG. 10. More specifically, thefirst movement end position is such that one of opposite peripheralpositions of the lower surface 52B of the lamp housing 40 is locatedabove the rotation center of the spin base (on the rotation axis C). Thesecond movement end position is such that the other peripheral positionof the lower surface 52B of the heater head 35 (a peripheral positionopposite from the one peripheral position with respect to the center ofthe lower surface 52B) is located above the rotation center of the spinbase 8 (on the rotation axis C).

The controller 55 first controls the pivot drive mechanism 36 to pivotthe heater arm 34, whereby the heater head 35 is moved from the centerof the spin base 8 to the first movement end position (indicated by thesolid line in FIG. 10). Then, the controller 55 controls the pivot drivemechanism 36 to pivot the heater arm 34 within the predetermined angularrange to reciprocally move the heater head 35 between the first movementend position and the second movement end position (indicated by thetwo-dot-and-dash line in FIG. 10) (Step S23: Liquid applying positionmoving step).

Thus, a cleaning liquid applying position to which the cleaning liquidfrom the back side liquid spout 84 is applied on the lower surface 52Bis reciprocally moved along an arcuate path crossing the circumferenceof the lower surface 52B within a range extending from the oneperipheral position to the other peripheral position through the centerof the lower surface 52B. Thus, the cleaning liquid is uniformlysupplied to the entire lower surface 52B of the lamp housing 40, wherebyforeign matter such as the SPM liquid mist is washed away from the lowersurface 52B of the lamp housing 40 with the cleaning liquid.

A cleaning liquid applying position to which the cleaning liquid fromthe upper cleaning liquid nozzle 94 is applied on the upper surface ofthe heater head 35 (the upper surface of the lid 41) is reciprocallymoved along an arcuate path. The cleaning liquid supplied to the uppersurface of the heater head 35 spreads over the entire upper surface ofthe heater head 35 and further spreads to a side wall of the heater head35.

Thus, the cleaning liquid uniformly spreads over the entire outersurface of the heater head 35, whereby the entire outer surface of theheater head 35 can be advantageously cleaned.

The spouting of the cleaning liquid from the upper cleaning liquidnozzle 94 and the backside liquid spout 84 and the reciprocal pivotingof the heater arm 34 are continued for a predetermined cleaning period.

Upon completion of the predetermined cleaning period (YES in STEP S24),the controller 55 closes the upper cleaning liquid valve 91 and thelower cleaning liquid valve 87 (Step S25) to stop spouting the cleaningliquid from the upper cleaning liquid nozzle 94 and the back side liquidspout 84.

As shown in FIG. 9B, the controller 55 opens the upper drying gas valve93 (Step S26). Thus, the drying gas from the upper drying gas nozzle 95is sprayed to the upper surface of the heating head 35 located at theheater cleaning position. The cleaning liquid adhering to the uppersurface of the heater head 35 is blown away by the drying gas.

Further, the controller 55 opens the lower drying gas valve 89 (StepS26: Lower drying gas spraying step). Thus, the drying gas from the backside gas spout 85 of the back side nozzle 82 is sprayed to the lowersurface 52B of the lamp housing 40 of the heater head 35 located at theheater cleaning position.

At this time, the controller 55 controls the pivot drive mechanism 36 topivot the heater arm 34 to reciprocally move the heater head 35 betweenthe first movement end position and the second movement end position.Thus, a spraying position to which the drying gas is sprayed from theback side gas spout 85 on the lower surface 52B is reciprocally movedalong the arcuate path crossing the circumference of the lower surface52B within the range extending from the one peripheral position to theother peripheral position through the center of the lower surface 52B.

Thus, the drying gas is uniformly supplied to the entire lower surface52B of the lamp housing 40, whereby the cleaning liquid adhering to thelower surface 52B of the lamp housing 40 is blown away by the dryinggas.

Further, the controller 55 controls the amplifier 54 to emit infraredradiation from the infrared lamp 38 (Step S26: Heat-drying step). Thus,the lamp housing 40 is warmed, whereby the cleaning liquid adhering tothe lower surface 52B and the outer periphery of the lamp housing 40evaporates to be removed.

The spouting of the drying gas from the upper drying gas nozzle 95 andthe back side nozzle 82 and the emission of the infrared radiation fromthe infrared lamp 38 are continued for a predetermined drying period.

Upon completion of the predetermined drying period (YES in Step S27),the controller 55 closes the upper drying gas valve 93 and the lowerdrying gas valve 89 (Step S28) to stop spouting the drying gas from theupper drying gas nozzle 95 and the back side gas spout 85.

Further, the controller 55 controls the pivot drive mechanism 36 topivot the heater arm 34 to move the cleaned heater head 35 back to itshome position.

Upon completion of the heater head cleaning/drying step, the processsequence for the resist removing process ends.

According to this embodiment, as described above, the cleaning operationfor cleaning the heater head 35 is performed in the resist removingprocess for each wafer W. In this cleaning operation, the heater head 35is located at the heater cleaning position in opposed relation to theback side liquid spout 84 above the back side liquid spout 84. Thecleaning liquid is spouted vertically upward from the back side liquidspout 84. The cleaning liquid from the back side liquid spout 84 gushesvertically upward to be applied to the lower surface 52B of the lamphousing 40 of the heater head 35 located at the heater cleaningposition.

A great amount of the SPM liquid mist generated in the SPM liquid filmheating step is liable to adhere to the lower surface 52B of the lamphousing 40. Since the SPM liquid mist adhering to the lower surface 52Bof the lamp housing 40 can be washed away with the cleaning liquidsupplied from the back side liquid spout 84 to the lower surface 52B ofthe lamp housing 40, the lower surface 52B of the lamp housing 40 can beadvantageously cleaned. Thus, the lower surface 52B of the lamp housing40 can be kept clean. As a result, it is possible to prevent thereduction in the intensity of the infrared radiation outputted from thelamp housing 40, while preventing the lower surface 52B of the housing40 from becoming the source of particles.

After the cleaning of the heater head 35, the outer surface of theheater head 35 is dried. This prevents the cleaning liquid remaining onthe outer surface of the heater head 35 from adversely influencing thetreatment of the wafer W.

The embodiment described above may be modified as mentioned in thefollowings.

In the embodiment described above, the cleaning liquid is supplied tothe heater head 35 from both of the upper cleaning liquid nozzle 94 andthe back side liquid spout 84 in the cleaning of the heater head 35 byway of example. Alternatively, the heater head 35 may be cleaned bysupplying the cleaning liquid to the heater head 35 only from the backside liquid spout 84 without supplying the cleaning liquid from theupper cleaning liquid nozzle 94 in the heater head cleaning operation.In this case, the spraying of the drying gas from the upper drying gasnozzle 95 to the heater head 35 is not necessary in the heater headdrying operation.

In the embodiment described above, the cleaning liquid applying positionon the lower surface 52B of the heater head 35 is moved by horizontallyreciprocally moving the heater head 35. However, a nozzle having a spoutadapted to spout a liquid in a variable liquid spouting direction, forexample, may be employed as the back side nozzle 82 instead of thearrangement of moving the heater head 35. In this case, the cleaningliquid applying position on the lower surface 52B of the heater head 35can be moved by changing the cleaning liquid spouting direction in whichthe cleaning liquid is spouted from the spout.

In the embodiment described above, a spray-drying operation in which thecleaning liquid adhering to the heater head 35 is blown away by sprayingthe drying gas from the upper drying gas nozzle 95 and the back sidenozzle 82, and a heat-drying operation in which the lamp housing 40 iswarmed by the infrared lamp 38 are both performed in the heater headdrying operation by way of example. However, the heater head 35 may bedried by performing only the heat-drying operation with the use of theinfrared lamp 38 without performing the spray-drying operation with theuse of the drying gas.

The back side nozzle 82 has the back side liquid spout 84 and the backside gas spout 85. Instead of this nozzle, a nozzle configured such thatthe cleaning liquid and the drying gas are selectively spouted from asingle spout may be employed.

The heater arm 34 may be cleaned in the heater head cleaning/drying step(Step S10 shown in FIG. 5). The cleaning liquid spouted from the uppercleaning liquid nozzle 94 may be used for the cleaning of the heater arm34. Alternatively, a bar nozzle (not shown) separately provided in thetreatment chamber 2 may be used for the cleaning of the heater arm 34.The bar nozzle includes a multiplicity of spouts horizontally arrangedin a single row or in plural rows and each directed vertically downward,and is disposed, for example, in an upper region of the treatmentchamber 2. In this case, the cleaning liquid is spouted from therespective spouts of the bar nozzle with the heater arm 34 (and theheater head 35) being located below the bar nozzle in opposed relationto the bar nozzle. Thus, the cleaning liquid falls over an outer surfaceof the heater arm 34 to clean the outer surface of the heater arm 34.

Further, the interior of the treatment chamber 2 may be cleaned (achamber cleaning operation may be performed) in the heater headcleaning/drying step (Step S10 shown in FIG. 5).

FIG. 11 is a diagram schematically showing the construction of asubstrate treatment apparatus 101 according to another embodiment of thepresent invention. In FIG. 11, components corresponding to those shownin FIG. 1 are designated by the same reference characters as in FIG. 1,and duplicate description will be omitted.

A wafer rotating mechanism (substrate holding means) 3 which holds androtates a wafer W, a removal liquid nozzle (chemical liquid supplyingmeans) 4 which supplies an SPM liquid (exemplary resist removal liquid)as a chemical liquid to a front surface (upper surface) of the wafer Wheld by the wafer rotating mechanism 3, a heater head (heater) 35 whichis located in opposed relation to the front surface of the wafer W heldby the wafer rotating mechanism 3 to heat the SPM liquid on the frontsurface of the wafer W, and a cleaning pod (storage container) 180 areprovided in a treatment chamber 2 of the substrate treatment apparatus101.

The cleaning pod 180 is disposed at the home position of the heater head35. The cleaning pod 180 is a bottomed cylindrical container. The heaterhead 35 is accommodated in stand-by in the cleaning pod 180 when it isnot used.

FIG. 12 is a diagram showing the structure of the cleaning pod 180. Thecleaning pod 180 is a bottomed cylindrical container. The cleaning pod180 has an open top, which defines an inlet for receiving the heaterhead 35. The heater head 35 is accommodated in the cleaning pod 180through the inlet. The cleaning pod 180 includes a cylindricalperipheral wall 181 and a bottom 182 connected to a lower edge of theperipheral wall 181.

A drain port 183 is provided in a generally center portion of the bottom182. A drainage line 184 is connected at one end thereof to the drainport 183 on the lower surface of the bottom 182. The other end of thedrainage line 184 is connected to a drainage equipment for treatment ofdrained liquid. A drain valve 185 for opening and closing the drainageline 184 is provided in the drainage line 184. The drain valve 185 isusually open.

A cleaning liquid nozzle (cleaning liquid supplying means) 186 forsupplying DIW as an exemplary cleaning liquid to the outer surface ofthe heater head 35 is provided on the peripheral wall 181. The cleaningliquid is supplied to the cleaning liquid nozzle 186 through a cleaningliquid supply line (cleaning liquid supplying means) 187. A cleaningliquid valve (cleaning liquid supplying means) 188 is provided in thecleaning liquid supply line 187. With the cleaning liquid valve 188open, the cleaning liquid is supplied to the cleaning liquid nozzle 186to be spouted from the spout of the cleaning liquid nozzle 186.

When the cleaning liquid is spouted from the cleaning liquid nozzle 186with the drain valve 185 being closed, the cleaning liquid flows to thebottom 182 to be retained in the cleaning pod 180. With the drain valve185 open, the cleaning liquid retained in the cleaning pod 180 isdrained from the drain port 183 through the drainage line 184.

A drying gas nozzle (drying gas spraying means) 189 for supplyingnitrogen gas as an exemplary drying gas to the outer surface of theheater head 35 is provided on the peripheral wall 181 at a position alittle lower than an upper edge of the peripheral wall 181. In thisembodiment, the drying gas nozzle 189 includes a plurality of drying gasnozzles 189 (e.g., a pair of drying gas nozzles 189). The pair of dryinggas nozzles 189 respectively have spouts which are, for example,disposed on the peripheral wall 181 at the same height level in opposedrelation to each other with respect to a center axis of the cleaning pod180.

The drying gas is supplied to the respective drying gas nozzles 189through drying gas supply lines (drying gas spraying means) 190. Dryinggas valves (drying gas spraying means) 191 are respectively provided inthe drying gas supply lines 190. With the drying gas valves 191 open,the drying gas is supplied to the corresponding drying gas nozzles 189.The drying gas is spouted generally horizontally from the drying gasnozzles 189 inward of the cleaning pod 180.

FIG. 13 is a block diagram showing the electrical construction of thesubstrate treatment apparatus 101. In FIG. 13, components correspondingto those shown in FIG. 4 are designated by the same reference charactersas in FIG. 4. The substrate treatment apparatus 101 includes acontroller 55 including a micro computer. The controller 55 is connectedto the chuck rotative drive mechanism 6, the amplifier 54, the pivotdrive mechanism 36, the lift drive mechanism 37, the first liquid armpivot mechanism 12, the second liquid arm pivot mechanism 29, theremoval liquid valve 23, the DIW valve 27, the SC1 valve 31, the drainvalve 185, the cleaning liquid valve 188, the drying gas valves 191 andthe like, which are controlled by the controller 55.

An exemplary resist removing process to be performed by the substratetreatment apparatus 101 is substantially the same as in the precedingembodiment. That is, the substrate treatment apparatus 101 can alsoperform the resist removing process described with reference to FIGS. 5,6A, 6B and 7. However, the heater head cleaning/drying step (Step S10 inFIG. 5) is performed in a different manner and, therefore, will bedescribed below.

When the heater head 35 is located at its home position, the heater head35 is accommodated in the cleaning pod 180. That is, the controller 55drives the pivot drive mechanism 36 to move the heater arm 34 so thatthe heater head 35 is located vertically above the top of the cleaningpod 180. Further, the controller 55 controls the lift drive mechanism 37to move the heater arm 34 and the heater head 35 vertically downwarduntil the heater head 35 reaches its home position. Upon reaching thehome position, the heater head 35 is in stand-by at that position. Atthe home position, at least the lamp housing 40 of the heater head 35 isentirely accommodated (preferably, the heater head 35 is entirelyaccommodated) in the cleaning pod 180.

In this embodiment, the heater head 35 is not cleaned above the spinbase 8 but at the home position. Therefore, the heater head 35 can becleaned even without the wafer W unloaded, i.e., even with the wafer Wpresent on the spin base 8, as long as the heater head 35 is not used.That is, the heater head 35 can be cleaned irrespective of theprogression status of the resist removing process. Therefore, the heaterhead 35 can be cleaned at any time in the non-use period. Morespecifically, the cleaning operation and the drying operation (Step S20:Heater head cleaning/drying step indicated by a two-dot-and-dash line inFIG. 5) may be performed on the heater head 35 returned to the homeposition after the completion of the SPM liquid film heating step (StepS4 shown in FIG. 5). The heater head cleaning/drying step may beperformed at any time after the SPM liquid film heating step.

FIG. 14 is a flow chart showing an exemplary heater head cleaning/dryingstep. FIG. 15A is a schematic diagram for explaining the cleaningoperation of the heater head cleaning/drying step, and FIGS. 15B and 15Care schematic diagrams for explaining the drying operation of the heaterhead cleaning/drying step.

At a predetermined cleaning time, the controller 55 closes the drainvalve 185, and opens the cleaning liquid valve 188 (Step S31). When thecleaning liquid is spouted from the cleaning liquid nozzle 186 with thedrain valve 185 being closed, the cleaning liquid flows to the bottom182 of the cleaning pod 180 to be retained in the cleaning pod 180 asshown in FIG. 15A. The spouting of the cleaning liquid from the cleaningliquid nozzle 186 is continued until the liquid surface level of thecleaning liquid retained in the cleaning pod 180 reaches a predeterminedcleaning height level. The cleaning height level is defined at a higherlevel than the lower surface 52B of the heater head 35 located at thehome position. Therefore, a lower outer surface portion of the lamphousing 40 (the lower surface 52B and a lower outer peripheral surfaceportion of the peripheral wall of the lamp housing 40) is immersed inthe cleaning liquid after the liquid surface of the cleaning liquidretained in the cleaning pod 180 reaches the cleaning height level.

If the liquid surface level of the cleaning liquid retained in thecleaning pod 180 reaches the cleaning height level (YES in Step S32),the controller 55 closes the cleaning liquid valve 188 (Step S33). Thus,the supply of the cleaning liquid from the cleaning liquid nozzle 186 isstopped. The liquid surface level of the cleaning liquid may bedetected, for example, by a liquid surface sensor (not shown) and, basedon a detection result outputted from the liquid surface sensor, thecontroller 55 may judge that the liquid surface level reaches thecleaning height level. Alternatively, a liquid retaining period requiredfor the liquid surface level to reach the cleaning height level in thecleaning pod 180 from an empty state of the cleaning pod 180 may bepreliminarily determined, and the cleaning liquid valve 188 may beclosed after a lapse of the liquid retaining period from the opening ofthe cleaning liquid valve 188.

The SPM liquid mist and other foreign matter adhering to the lowersurface 52B of the lamp housing 40 are washed away by immersing thelower surface 52B of the lamp housing 40 in the cleaning liquid.Thereafter, the cleaning liquid is kept retained in a present amount inthe cleaning pod 180, whereby the lower outer surface portion of thelamp housing 40 is kept immersed in the cleaning liquid.

After a lapse of a predetermined cleaning period (immersion period) fromthe closing of the cleaning liquid valve 188 (YES in Step S34), thecontroller 55 opens the drain valve 185 (Step S35). With the drain valve185 open, the cleaning liquid retained in the cleaning pod 180 isdrained from the drain port 183 through the drainage line 184. Thus, theimmersion of the lower outer surface portion of the lamp housing 40 inthe cleaning liquid is completed.

Subsequently, the drying operation shown in FIGS. 15B and 15C isperformed.

After the cleaning liquid is drained from the cleaning pod 180, thecontroller 55 opens the drying gas valves 191 (Step S36). Thus, thedrying gas is generally horizontally spouted from the spouts of thedrying gas nozzles 189 inward of the cleaning pod 180.

The controller 55 controls the lift drive mechanism 37 to move up theheater head 35, whereby the spouts of the drying gas nozzles 189 areopposed to the outer circumferential surface of the peripheral wall ofthe lamp housing 40.

Thereafter, the controller 55 controls the lift drive mechanism 37 tomove up and down the heater head 35 between a predetermined upperposition (indicated by a solid line in FIG. 15B) and a middle position(indicated by a two-dot-and-dash line in FIG. 15B and indicated by asolid line in FIG. 15C) (Step S37). At the upper position of the heaterhead 35, the lower surface 52B of the heater head 35 is located sidewardof the spouts of the drying gas nozzles 189. Therefore, the upperposition is higher than the home position. The middle position of theheater head 35 is defined between the upper position and the homeposition. At the middle position, a portion of the outer peripheralsurface of the heater head 35 (the outer peripheral surface of the lamphousing 40) immersed in the cleaning liquid in the cleaning operationdescribed above is located at a lower level than the drying gas nozzles189.

As the heater head 35 is moved up and down, a drying gas sprayingposition (supply position) to which the drying gas is sprayed on thelower outer peripheral surface portion of the peripheral wall of thelamp housing 40 is also vertically moved (moved up and down). Therefore,the drying gas can be extensively sprayed over the outer peripheralsurface of the peripheral wall of the lamp housing 40. Thus, thecleaning liquid adhering to the lower outer peripheral surface portionof the peripheral wall of the lamp housing 40 can be blown away to beremoved.

When the heater head 35 is located at the upper position as shown inFIG. 15B, the drying gas spouted from the drying gas nozzles 189 flowsalong the lower surface 52B of the lamp housing 40 slightly below thelower surface 52B. The cleaning liquid adhering to the lower surface 52Bis blown away to be removed by the drying gas thus flowing. The cleaningliquid blown from the heater head 35 is received by the peripheral wall181. Therefore, droplets of the cleaning liquid are substantiallyprevented from scattering outside the cleaning pod 180.

In the vertical movement of the heater head 35, the controller 55 maycontrol the lift drive mechanism 37 to move up the heater head 35 to theupper position and, before starting the downward movement of the heaterhead 35, once stop the vertical movement of the heater head 35 to keepthe heater head 35 at the upper position for a predetermined period. Inthis case, the cleaning liquid can be more effectively removed from thelower surface 52B of the lamp housing 40.

Further, the controller 55 controls the amplifier 54 to emit theinfrared radiation from the infrared lamp 38 (Step S38: Heat-dryingstep), while the drying gas is spouted from the drying gas nozzles 189in Step S36. Thus, the lamp housing 40 is warmed, whereby the cleaningliquid adhering to the lower portion of the lamp housing 40 evaporatesto be removed.

The spouting of the drying gas from the drying gas nozzles 189 and theemission of the infrared radiation from the infrared lamp 38 arecontinued for a predetermined drying period from the start of theemission of the infrared radiation from the infrared lamp 38.

After a lapse of the drying period (YES in Step S39), the controller 55closes the drying gas valves 191 (Step S40) to stop spouting the dryinggas from the drying gas nozzles 189. Further, the controller 55 controlsthe amplifier 54 to stop emitting the infrared radiation from theinfrared lamp 38 (Step S40).

The controller 55 controls the lift drive mechanism 37 to move down theheater head 35 back to its home position (Step S41).

Thus, the heater head cleaning/drying step ends.

According to this embodiment, as described above, the cleaning operationis performed for cleaning the heater head 35 every time the resistremoving process is performed on a wafer W. In the cleaning operation,the heater head 35 is located at its home position. With the drain valve185 closed, the cleaning liquid is supplied from the cleaning liquidnozzle 186 to be thereby retained in the cleaning pod 180. The lowerouter surface portion of the lamp housing 40 is immersed in the cleaningliquid retained in the cleaning pod 180, whereby the lower outer surfaceportion of the lamp housing 40 including the lower surface 52B can becleaned.

A great amount of SPM liquid mist generated in the SPM liquid filmheating step (Step S4 shown in FIG. 5) is liable to adhere to the lowersurface 52B of the lamp housing 40. The SPM mist can be washed away withthe cleaning liquid supplied to the lower surface 52B of the lamphousing 40. Thus, the lower surface 52B of the lamp housing 40 can beadvantageously cleaned, so that the lower surface 52B of the lamphousing 40 can be kept clean. This prevents the reduction in theintensity of the infrared radiation outputted from the lamp housing 40,while preventing the lower surface 52B of the lamp housing from becominga source of particles.

After the cleaning operation is performed on the heater head 35, thelower outer surface portion of the lamp housing 40 including the lowersurface 52B is dried. This prevents the cleaning liquid from remainingon the lower outer surface portion of the lamp housing 40 to adverselyinfluence the treatment of the wafer W.

FIG. 16 is a diagram showing the structure of another exemplary cleaningpod (accommodating member). FIG. 17 is a sectional view taken along asectional line A-A and viewed in an arrow direction in FIG. 16. Thecleaning pod 280 shown in FIGS. 16 and 17 is provided instead of thecleaning pod 180 in the arrangement shown in FIG. 11.

In FIG. 16 and the like, components corresponding to those shown in FIG.12 are designated by the same reference characters as in FIG. 12, andduplicate description will be omitted.

The cleaning pod 280 includes a plurality of cleaning liquid nozzles(e.g., four cleaning liquid nozzles) 111 provided in a disk-shapedbottom 282 thereof. The cleaning liquid nozzles 111 each have a cleaningliquid spout 110 through which the cleaning liquid is spouted toward thelower surface 52B of the heater head 35.

As shown in FIGS. 16 and 17, the cleaning liquid spouts 110 are disposedin a peripheral portion of the bottom 282 equidistantlycircumferentially of the bottom 282. The spouting directions of thecleaning liquid spouts 110 each extend obliquely upward at apredetermined angle (e.g., 30 degrees to 60 degrees) with respect to thevertical direction toward the center axis of the cylindrical cleaningpod 180. The cleaning liquid is supplied to the cleaning liquid nozzles111 through cleaning liquid supply lines 112. Cleaning liquid valves 113are respectively provided in the cleaning liquid supply lines 112. Withthe cleaning liquid valves 113 open, the cleaning liquid is supplied tothe corresponding cleaning liquid nozzles 111 and spouted from thecleaning liquid spouts 110 of the cleaning liquid nozzles 111.

In the cleaning pod 280, the cleaning operation is performed in adifferent manner from that in the cleaning pod 180 shown in FIG. 12 andthe like. In the cleaning pod 280, on the other hand, the dryingoperation is performed in the same manner as in the cleaning pod 180shown in FIG. 12 and the like. In the cleaning pod 280, the heater head35 is subjected to the cleaning operation at a cleaning position (shownin FIG. 16) slightly above the home position.

At a predetermined cleaning time, the controller 55 controls the liftdrive mechanism 37 to move up the heater head 35 to locate the heaterhead 35 at the cleaning position which is defined slightly above thehome position and below the middle position (shown in FIG. 15C).

Further, the cleaning liquid valves 113 are opened to spout the cleaningliquid from the respective cleaning liquid spouts 110. The cleaningliquid spouted from the cleaning liquid spouts 110 is applied to thelower surface 52B of the heater head 35. In this embodiment, thecleaning liquid spouted from the cleaning liquid spouts 110 is appliedto portions of the round lower surface 52B intermediate between thecleaning liquid spouts 110 and the center of the lower surface 52B. Thecleaning liquid applied to the lower surface 52B spreads over the lowersurface 52B around the lower surface 52B. After a lapse of apredetermined cleaning period from the start of the spouting of thecleaning liquid from the cleaning liquid nozzles 111, the cleaningliquid valves 113 are closed. The drain valve 185 is kept openthroughout the cleaning operation. Therefore, the cleaning liquidflowing to the bottom 282 is not retained on the bottom 282, but drainedout of the apparatus through the drainage line 184.

In the cleaning pod 280, the SPM liquid mist and other foreign matteradhering to the lower surface 52B of the lamp housing 40 are washed awaywith the cleaning liquid supplied to the lower surface 52B of the lamphousing 40. Thus, the lower surface 52B of the lamp housing 40 can beadvantageously cleaned.

Thereafter, the drying operation is performed as described withreference to FIGS. 15B and 15C.

FIG. 18 is a diagram showing the structure of further another exemplarycleaning pod (accommodating member) 380. FIG. 19 is a sectional viewtaken along a sectional line B-B and viewed in an arrow direction inFIG. 18. The cleaning pod 380 shown in FIGS. 18 and 19 is employedinstead of the cleaning pod 180 in the arrangement shown in FIG. 11.

In FIG. 18 and the like, components corresponding to those shown in FIG.12 are designated by the same reference characters as in FIG. 12, andduplicate description will be omitted.

In this cleaning pod 380, a plurality of cleaning liquid nozzles 201(e.g., five cleaning liquid nozzles, only three of which are illustratedin FIG. 18) are provided in a disk-shaped bottom 382 of the cleaningliquid pod 380. The cleaning liquid nozzles 201 each have a cleaningliquid spout 200 through which the cleaning liquid is spouted toward thelower surface 52B of the heater head 35. Since one of the cleaningliquid spouts 200 is disposed at the center of the bottom 382, a drainport 283 is provided in a peripheral portion of the bottom 382.

The cleaning liquid spouts 200 include a center spout 200A to be opposedfrom below to the center of the lower surface 52B of the heater head 35located at the home position, and a plurality of peripheral spouts(e.g., four peripheral spouts) 200B to be opposed from below to aperipheral portion of the lower surface 52B of the heater head 35. Theperipheral spouts 200B are disposed circumferentially equidistantly inthe peripheral portion of the bottom 382. The spouting directions of therespective cleaning liquid spouts 200A, 200B are vertically upward. Thecleaning liquid is supplied to the cleaning liquid nozzles 201 through acleaning liquid supply line 202. A cleaning liquid valve 203 is providedin the cleaning liquid supply line 202. With the cleaning liquid valve203 open, the cleaning liquid is supplied to the cleaning liquid nozzles201 to be spouted from the cleaning liquid spouts 200 (200A, 200B) ofthe cleaning liquid nozzles 201.

In the cleaning pod 380, the cleaning operation is performed in adifferent manner from that in the cleaning pod 180 shown in FIG. 12 andthe like. In the cleaning pod 380, on the other hand, the dryingoperation is performed in the same manner as in the cleaning pod 180shown in FIG. 12 and the like. In the cleaning pod 380, the heater head35 is subjected to the cleaning operation at a cleaning position (shownin FIG. 18) as in the cleaning pod 280 shown in FIG. 16 and the like.

After the heater head 35 is located at the cleaning position, thecleaning liquid valve 203 is opened to spout the cleaning liquid fromthe respective cleaning liquid spouts 200 (200A, 200B). The cleaningliquid spouted from the cleaning liquid spouts 200 is applied to thelower surface 52B of the heater head 35 to spread over the lower surface52B around the lower surface 52B. After a lapse of a predeterminedcleaning period from the start of the spouting of the cleaning liquidfrom the cleaning liquid nozzles 201, the cleaning liquid valve 203 isclosed. The drain valve 185 is kept open throughout the cleaningoperation. Therefore, the cleaning liquid flowing to the bottom 382 isnot retained on the bottom 382, but drained through the drainage line184 out of the apparatus.

In this manner, the SPM liquid mist and other foreign matter are washedaway with the cleaning liquid supplied to the lower surface 52B of thelamp housing 40. Thus, the lower surface 52B of the lamp housing 40 canbe advantageously cleaned.

Thereafter, the drying operation is performed as described above withreference to FIGS. 15B and 15C.

The embodiment described with reference to FIGS. 12 to 19 may bemodified as mentioned in the followings.

The cleaning liquid is not necessarily required to be retained in thecleaning pod 280 of FIG. 16 and in the cleaning pod 380 of FIG. 17.Therefore, the drain valve 185 may be obviated in the cleaning pod 280,380.

The number of the drying gas nozzles 189 is not limited to two, butthree or more drying gas nozzles 189 may be provided. In this case, thedrying gas nozzles 189 are desirably disposed at the same height level,and desirably disposed circumferentially equidistantly.

The spouting directions of the drying gas nozzles 189 may be obliquelydownward rather than horizontal.

The drying gas nozzles 189 are not necessarily required to be providedin the peripheral wall 181 of the cleaning pod, but may be disposedabove the top of the cleaning pod 180, 280, 380 (i.e., outside thecleaning pod).

In the embodiments described above, both the spray-drying operation forspraying the drying gas from the drying gas nozzles 189 and theheat-drying operation for warming the lamp housing 40 by the infraredlamp 38 are performed to dry the outer surface of the lamp housing 40 inthe heater head drying operation by way of example. However, only theheat-drying operation with the use of the infrared lamp 38 may beperformed to dry the outer surface of the lamp housing 40 withoutperforming the spray-drying operation with the use of the drying gas.

Where the heater head cleaning/drying step is performed after the waferW is unloaded from the treatment chamber 2, the heater arm 34 may becleaned in the heater head cleaning/drying step. The cleaning of theheater arm 34 may be achieved, for example, by using a bar nozzle (notshown) separately provided in the treatment chamber 2. The bar nozzleincludes a multiplicity of spouts horizontally arranged in a single rowor in plural rows and each directed vertically downward, and is disposedin an upper region of the treatment chamber 2. In this case, thecleaning liquid is spouted from the respective spouts of the bar nozzlewith the heater arm 34 being located below the bar nozzle in opposedrelation to the bar nozzle. Thus, the cleaning liquid falls over theouter surface of the heater arm 34 to clean the outer surface of theheater arm 34.

Where the heater head cleaning/drying step is performed after the waferW is unloaded from the treatment chamber 2, the interior of thetreatment chamber 2 may be cleaned (chamber cleaning may be performed)in the heater head cleaning/drying step of Step S10.

The two embodiments described above with reference to FIGS. 1 to 19 maybe modified as mentioned in the followings.

The DIW is used as the cleaning liquid for the cleaning operation by wayof example. However, the cleaning liquid is not limited to the DIW, buta dilute hydrofluoric acid aqueous solution, carbonated water,hydrolytic ion water, ozone water or the like may be used as thecleaning liquid. Where a chemical liquid such as the dilute hydrofluoricacid aqueous solution is used as the cleaning liquid, a rinsingoperation may be performed for rinsing away the cleaning liquid from theheater head 35 with the use of the DIW or the carbonated water after thecleaning liquid is supplied to the heater head 35.

The nitrogen gas is used as the drying gas by way of example, but cleanair or other inert gas may be used as the drying gas.

The embodiments described above are applicable to a heater cleaningmethod for cleaning a heater provided in a substrate treatment apparatusadapted to selectively etch a nitride film formed on a major surface ofa substrate with the use of a higher temperature etching liquid such ascontaining phosphoric acid.

While the present invention has been described in detail by way of theembodiments thereof, it should be understood that these embodiments aremerely illustrative of the technical principles of the present inventionbut not limitative of the invention. The scope of the present inventionis to be limited only by the appended claims.

This application corresponds to Japanese Patent Application Nos.2012-68082 and 2012-68083 filed in the Japan Patent Office on Mar. 23,2012, the disclosure of which is incorporated herein by reference in itsentirety.

REFERENCE SIGNS LIST

-   1 SUBSTRATE TREATMENT APPARATUS-   2 TREATMENT CHAMBER-   2A PARTITION WALL-   3 WAFER ROTATING MECHANISM-   4 REMOVAL LIQUID NOZZLE-   5 CUP-   6 CHUCK ROTATIVE DRIVE MECHANISM-   7 SPIN SHAFT-   8 SPIN BASE-   9 CLAMPING MEMBERS-   11 FIRST LIQUID ARM-   12 FIRST LIQUID ARM PIVOT MECHANISM-   15 REMOVAL LIQUID SUPPLY LINE-   23 REMOVAL LIQUID VALVE-   24 DIW NOZZLE-   SC1 NOZZLE-   26 DIW SUPPLY LINE-   27 DIW VALVE-   28 SECOND LIQUID ARM-   29 SECOND LIQUID ARM PIVOT MECHANISM-   30 SC1 SUPPLY LINE-   31 SC1 VALVE-   33 SUPPORT SHAFT-   34 HEATER ARM-   35 HEATER HEAD-   36 PIVOT DRIVE MECHANISM-   37 LIFT DRIVE MECHANISM-   38 INFRARED LAMP-   39 OPENING-   40 LAMP HOUSING-   40A FLANGE-   41 LID-   42 SUPPORT MEMBER-   42A UPPER SURFACE-   42B LOWER SURFACE-   43 ANNULAR PORTION-   44, 45 STRAIGHT PORTIONS-   46, 47 INSERTION HOLES-   48 O-RINGS-   49 LOWER SURFACE-   50 UPPER BASE SURFACE-   51 GROOVE-   52 BOTTOM PLATE-   52A UPPER SURFACE-   52B LOWER SURFACE-   54 AMPLIFIER-   55 CONTROLLER-   56 BOLTS-   58, 59 INSERTION HOLES-   60 GAS SUPPLY PASSAGE-   61 EVACUATION PASSAGE-   62 GAS SUPPLY PORT-   63 EVACUATION PORT-   64 GAS SUPPLY LINE-   65 EVACUATION LINE-   70 LIQUID FILM-   80 BACK SIDE LIQUID SUPPLY PIPE-   81 BACK SIDE GAS SUPPLY PIPE-   82 BACK SIDE NOZZLE-   84 BACK SIDE LIQUID SPOUT-   85 BACK SIDE GAS SPOUT-   86 LOWER CLEANING LIQUID SUPPLY LINE-   87 LOWER CLEANING LIQUID VALVE-   88 LOWER DRYING GAS SUPPLY LINE-   89 LOWER DRYING GAS VALVE-   90 UPPER CLEANING LIQUID SUPPLY LINE-   91 UPPER CLEANING LIQUID VALVE-   92 UPPER DRYING GAS SUPPLY LINE-   93 UPPER DRYING GAS VALVE-   94 UPPER CLEANING LIQUID NOZZLE-   95 UPPER DRYING GAS NOZZLE-   101 SUBSTRATE TREATMENT APPARATUS-   110 CLEANING LIQUID SPOUTS-   111 CLEANING LIQUID NOZZLES-   112 CLEANING LIQUID SUPPLY LINES-   113 CLEANING LIQUID VALVES-   180, 280, 380 CLEANING PODS-   181 PERIPHERAL WALL-   182 BOTTOM-   183 DRAIN PORT-   184 DRAINAGE LINE-   185 DRAIN VALVE-   186 CLEANING LIQUID NOZZLE-   187 CLEANING LIQUID SUPPLY LINE-   188 CLEANING LIQUID VALVE-   189 DRYING GAS NOZZLES-   190 DRYING GAS SUPPLY LINES-   191 DRYING GAS VALVES-   200 CLEANING LIQUID SPOUTS-   200A CENTER SPOUT-   200B PERIPHERAL SPOUTS-   201 CLEANING LIQUID NOZZLES-   202 CLEANING LIQUID SUPPLY LINE-   203 CLEANING LIQUID VALVE-   282 BOTTOM-   283 DRAIN PORT-   382 BOTTOM-   A SECTIONAL LINE-   B SECTIONAL LINE-   C ROTATION AXIS-   S1 TO S10, S20 TO S29, S31 TO S41 STEPS-   W WAFER

1. A heater cleaning method for cleaning a heater which has an infraredlamp and a housing, and is arranged in opposed relation to an uppersurface of a substrate held by substrate holding means for heating theupper surface, the heater cleaning method comprising: a heater locatingstep of locating the heater at a heater cleaning position above a lowernozzle such that the heater is opposed to a first spout of the lowernozzle, the lower nozzle being adapted to spout a liquid upward from thefirst spout in opposed relation to a lower surface of the substrate heldby the substrate holding means; and a lower cleaning liquid spoutingstep of supplying a cleaning liquid to the lower nozzle to spout thecleaning liquid upward from the first spout with no substrate being heldby the substrate holding means to thereby supply the cleaning liquid toan outer surface of the housing of the heater located at the heatercleaning position.
 2. The heater cleaning method according to claim 1,further comprising an upper cleaning liquid spouting step of spoutingthe cleaning liquid downward from an upper nozzle disposed above thefirst spout to supply the cleaning liquid to the outer surface of thehousing concurrently with the lower cleaning liquid spouting step. 3.The heater cleaning method according to claim 1, further comprising aliquid applying position moving step of moving a liquid applyingposition to which the cleaning liquid spouted from the first spout isapplied on the outer surface of the housing concurrently with the lowercleaning liquid spouting step.
 4. The heater cleaning method accordingto claim 1, further comprising a drying step of removing the cleaningliquid from the outer surface of the housing after completion of thelower cleaning liquid supplying step.
 5. The heater cleaning methodaccording to claim 4, wherein the drying step includes a heat-dryingstep of irradiating the housing with infrared radiation emitted from theinfrared lamp to heat the outer surface of the housing for drying theouter surface.
 6. The heater cleaning method according to claim 4,wherein the lower nozzle further has a second spout through which a gasis spouted upward, wherein the drying step includes a lower drying gasspraying step of supplying a drying gas to the lower nozzle to spray thedrying gas upward from the second spout, whereby the drying gas issupplied to the outer surface of the housing of the heater located atthe heater cleaning position.
 7. A substrate treatment apparatuscomprising: a heater having an infrared lamp and a housing accommodatingthe infrared lamp, the heater being adapted to heat a major surface of asubstrate at a treatment position at which the heater is opposed to themajor surface of the substrate; and cleaning liquid supplying meanswhich supplies a cleaning liquid to an outer surface of the housing withthe heater being located at a cleaning position different from thetreatment position.
 8. The substrate treatment apparatus according toclaim 7, wherein the cleaning position is a stand-by position at whichthe heater is in stand-by and is retracted from the treatment position.9. The substrate treatment apparatus according to claim 7, furthercomprising an accommodating member which accommodates the heater andreceives cleaning liquid splashed from the heater.
 10. The substratetreatment apparatus according to claim 9, wherein the accommodatingmember includes a bottomed storage container which has a drain portprovided in its bottom and is capable of storing a liquid, wherein thecleaning liquid supplying means includes a cleaning liquid nozzle whichsupplies the cleaning liquid to the storage container.
 11. The substratetreatment apparatus according to claim 10, further comprising: adrainage line which is connected to the drain port of the storagecontainer for draining the liquid stored in the storage container; and adrain valve provided in the drainage line for opening and closing thedrainage line.
 12. The substrate treatment apparatus according to claim7, wherein the cleaning liquid supplying means includes a cleaningliquid nozzle having a cleaning liquid spout through which the cleaningliquid is spouted toward the outer surface of the housing.
 13. Thesubstrate treatment apparatus according to claim 7, further comprisingdrying gas spraying means which sprays a drying gas toward the outersurface of the housing for removing the cleaning liquid from the outersurface of the housing.
 14. The substrate treatment apparatus accordingto claim 13, further comprising heater up-and-down moving means whichmoves up and down the heater, wherein the drying gas spraying meansincludes a drying gas nozzle which spouts the drying gas in a directioncrossing a heater up-and-down moving direction, the substrate treatmentapparatus further comprising spray-drying controlling means whichcontrols the drying gas spraying means and the heater up-and-down movingmeans to spout the drying gas from the drying gas nozzle and move up anddown the heater to thereby move up and down a drying gas supply positionto which the drying gas is supplied on the outer surface of the housing.15. The substrate treatment apparatus according to claim 7, furthercomprising heat-drying controlling means which irradiates the housingwith infrared radiation emitted from the infrared lamp to heat thecleaning liquid on the outer surface for drying the outer surface.
 16. Aheater cleaning method for cleaning a heater which has an infrared lampand a housing accommodating the infrared lamp, and heats a major surfaceof a substrate at a treatment position at which the heater is opposed tothe major surface of the substrate, the heater cleaning methodcomprising: a heater locating step of locating the heater at a cleaningposition different from the treatment position; and a cleaning liquidsupplying step of supplying a cleaning liquid to an outer surface of theheater located at the cleaning position.
 17. The heater cleaning methodaccording to claim 16, further comprising a drying step of removing thecleaning liquid from the outer surface of the housing after completionof the cleaning liquid supplying step.
 18. The heater cleaning methodaccording to claim 17, wherein the drying step includes a heat-dryingstep of irradiating the housing with infrared radiation emitted from theinfrared lamp to heat the cleaning liquid on the outer surface fordrying the outer surface.
 19. The heater cleaning method according toclaim 17, wherein the drying step includes: a heater up-and-down movingstep of moving up and down the heater; and a drying gas spouting step ofspouting a drying gas from a drying gas nozzle toward the outer surfaceof the housing in a direction crossing a heater up-and-down movingdirection.